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The current head of Samsung’s memory chip business, Chang Jong-hyun, will be retiring in the middle of March, which means there’ll be a vacancy at the top. The man who will fill it is expected to be a chip expert, and that’s exactly where Lin Jun-cheng fits the bill. A former TSMC engineer, Jun-cheng spent
While Samsung comfortably leads the smartphone industry with devices like the Galaxy S23 Ultra, its fortunes in the chip industry have been different. The company’s key rival, TSMC, dominates the segment, although Samsung has tried its best to gain parity, even coming close on some occasions. So it would be a big win for a company like Samsung to have some of the industry’s best talents on board to fulfill its ambitions in the semiconductor business. The manufacturer has done exactly that by hiring former TSMC engineer and industry veteran Lin Jun-cheng.
Lin’s appointment will come as a surprise as Samsung has been moving towards using its own packaging technology for its Exynos chips, with the Exynos 5 Octa chip now shipping with Samsung’s own Tight Pack technology. The company is said to have been considering licensing some chip packaging technology for some time, with the move towards its own packaging technology being a move towards greater efficiency and lower cost.
Samsung hasn’t put out a statement on the new talent acquisition, with the news emerging from local South Korean outlets, per The Korea Herald. These reports claim Lin has been hired as the senior VP of the advanced packaging team as part of the Device Solutions division. In the new role, Lin Jun-cheng will supposedly take charge of bolstering Samsung’s chip packaging technologies, a key driver in the rapid evolution and development of chipsets.